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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. T A =25°C, unless otherwise specified.
Symbol
V S
V B
V HO
V CC
V IN
dV S /dt
P D(2)(3)(4)
θ JA
T J
T S
T A
Characteristics
High-Side Offset Voltage
High-Side Floating Supply Voltage
High-Side Floating Output Voltage
Logic Fixed Supply Voltage
Logic Input Voltage
Allowable Offset Voltage Slew Rate
Power Dissipation
Thermal Resistance, Junction-to-Ambient
Junction Temperature
Storage Temperature
Ambient Temperature
Min.
V B -25
-0.3
V S -0.3
-0.3
-0.3
-40
Max.
V B +0.3
625
V B +0.3
25
V CC +0.3
± 50
0.625
200
+150
+150
+125
Unit
V
V/ns
W
°C/W
°C
°C
°C
Notes:
2. Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
3. Refer to the following standards:
JESD51-2: Integral circuits thermal test method environmental conditions - Natural convection
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages
4. Do not exceed P D under any circumstances.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
V B
V S
V HO
V IN
V CC
Parameter
High-Side Floating Supply Voltage
High-Side Floating Supply Offset Voltage
High-Side Output Voltage
Logic Input Voltage
Logic Supply Voltage
Min.
V S +10
6-V CC
V S
GND
10
Max.
V S +20
600
V B
V CC
20
Unit
V
? 2005 Fairchild Semiconductor Corporation
FAN7361, FAN7362 Rev. 1.0.8
4
www.fairchildsemi.com
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